|
Technical parameter: |
Project |
Process ability （
Unit
：mm） |
Au |
Sn |
|
minimum
thickness of plate |
0.2 |
0.2 |
|
V-CUT minimum
thickness of plate |
0.4 |
0.4 |
|
V-CUT
size range |
80~280 |
80~280 |
|
minimum
line width /line distance（0.50Z） |
0.075/0.075 |
0.1/0.1 |
|
minimum
line width /line distance（10Z） |
0.075/0.075 |
0.1/0.1 |
|
minimum
line width /line distance（
inner layer
）（10Z） |
0.075/0.075 |
0.075/0.075 |
|
gridding minimum
line width /line distance |
0.1/0.1 |
0.1/0.1 |
|
minimum spacing between the
copper foil and
the profile（including the
mounting hole
and NPTH hole） |
0.15 |
0.15 |
|
the minimum spacing between the
non-conterminous copper and the
inner layer |
0.25(4 layers)
0.３5(>4 layers)
|
0.25(4 layers)
0.３5(>4 layers) |
|
the minimum spacing between the
non-conterminous copper and the inner layer hole |
≥0.15(4 layers) |
≥0.15(4 layers) |
|
inner layer solder circle |
≥0.2(>4 layers) |
≥0.2(>4 layers) |
|
minimum
thickness of plate |
0.2(Double)
0.4(4 layers)
0.6(6 layers)
0.8(8 layers)
1.0(10 layers)
1.2(12 layers)
1.4(14 layers) |
0.2(Double)
0.4(4 layers)
0.6(6 layers)
0.8(8 layers)
1.0(10 layers)
1.2(12 layers)
1.4(14 layers) |
|
the minimum spacing between earthing
copper foil
& conducting wire |
0.2 |
0.2 |
|
the minimum
metallization molling
slotted eye |
0.6 |
0.6 |
|
the minimum
non-metallic computer molling
slotted eye |
0.8 |
0.8 |
| the minimum bore |
0.25 |
0.25 |
|
the copper thickness of the wall of hole
|
0.018~0.025 |
0.018~0.025 |
|
hole tolerance of metallization hole
|
±0.075 |
±0.075 |
|
hole tolerance of non-metallic hole |
±0.05 |
±0.05 |
